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Wafer Bump Twi-8000

Measuring Au straight bumps on wafer bump with high speed. Using high-precision laser displacement gauge, advanced DMA technology and unique algorithm can inspect 3D (bump height), SD (wafer surface defect) and 2D (diameter of bump) at the same time.

Features
  • High speed and high precision
  • Off-line review system
  • Simultaneous inspection system for 3D, SD and 2D
  • bump size : square 8μm or more

Wafer Bump Twi-8000

Wafer Bump Twi-8300

Measuring at faster rate the diameter and height of solder bump that have formed on the wafer.

Features
  • Bump size: Φ30μm or more
  • High speed and high precision
  • High speed signal processing with DMA

Wafer Bump Twi-8300

Contact Us
System Equipment Sales Department

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